QuestionI read your answer as to not re-size bonded Jewelry. Or any bonded jewelry. I bought a ring in Technibond and it is just a bit too tight. I have done some Silversmithing and was wondering if I would give it a try, what would happen? If i file away the bonding at the joint and around it would I be able to soder it?
AnswerHi, Debra.
You should not have to remove the outer layer to solder the ring. The real problem with sizing plated or overlay items is not getting the solder to flow and hold. The problem is discoloration and loss of the overlaid surface at the soldering area when the work is done.
When the heat is applied, what discoloration will happen is not fully predictable. One certainty is that when finished the outer layer will be gone and base metal will be exposed at the worked area.. If you are willing to accept that and what discoloration may occur, then go for it. The solder should flow well enough to join the ends together without any need to remove the outer layer.
A secret is to use a strong enough soldering flux to work with a base metal. Sometimes regular liquid flux will not clean well enough. I recommend a paste flux. This flux cools to the look of a layer of glass and requires more time to clean-up either in pickle pot or hot water to remove the flux residue. The advantage of the paste flux is solder will flow and flow well. I have used one called Handy Flux for difficult situations. While in use, the flux may show dark color away from the joint where it is cleaning off oxidation. When the flux is removed, all is fine.
I have not worked directly on a Technibond item but from what I have seen the work should be no problem, keeping in mind the reasons I recommend against it normally. Please get back sometime and tell me how it went for you if you get the chance.
God Bless and Peace. Thomas.
